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Title:
RESIN COMPOSITION AND RESIN CURED MATERIAL
Document Type and Number:
Japanese Patent JP2012177060
Kind Code:
A
Abstract:

To provide a resin cured material with highly uniform electrical insulation property and heat conductivity, and to provide a resin composition with excellent moldability.

The resin composition contains a compound having a liquid crystal unit having a mesogenic group, a flexible unit bound to both ends of the liquid unit, and a compound having a polymerizable group at a terminal. The flexible unit contains one or more types of groups selected from a group of a formula (A) (in the formula, n is an integer not more than 18). The flexible unit bound to one end of the liquid crystal unit, and the flexible unit bound to the other end of the liquid crystal unit are different.


Inventors:
MIMURA KENJI
NOBUTOKI EIJI
TOKIZAKI SHINYA
HAYAKAWA TERUAKI
MAEDA RINA
SAI KISEI
NAKAMURA AKIHIRO
TOKITA MASATOSHI
URUSHIBATA HIROAKI
KAKIMOTO MASAAKI
Application Number:
JP2011041806A
Publication Date:
September 13, 2012
Filing Date:
February 28, 2011
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
TOKYO INST TECH
International Classes:
C08G85/00; C08F2/44; C08F18/12; C08G59/02; C08K3/00; C08L101/06; H01B3/30
Domestic Patent References:
JP2007191442A2007-08-02
JPH11513360A1999-11-16
JP2012041507A2012-03-01
JP2010196015A2010-09-09
JP2000281629A2000-10-10
Foreign References:
WO2010144393A22010-12-16
WO2012077600A12012-06-14
Attorney, Agent or Firm:
Michiharu Soga
Suzuki Kenchi
Kajinami order
Kazuhiro Oyaku
Shunichi Ueda
Junichiro Yoshida
Satoshi Iino