To obtain a resin composition satisfying heat resistance, mechanical properties, electrical properties, low water absorption, adhesion, solvent resistance, and moldability, each required for the interlaminar insulation films in electronic parts, to obtain a cured product from the above composition, and to obtain an adhesive film by using the above composition and cured product.

This resin composition is obtained by compounding 1-99.9 pts.wt. of a polyquinoline resin, 0.1-99 pts.wt. of a cyanate compound of the formula (Ar1 is an n-valent organic group containing at least two carbon atoms, and (n) is an integer of ≥2), and 0-95 pts.wt. of another organic compound or inorganic compound so as to be 100 pts.wt. as a whole. The second objective adhesive film is obtained by using the above composition and a cured product therefrom.