Title:
RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JP2002212235
Kind Code:
A
Abstract:
To provide a resin composition which is excellent in rubbing resistance, keeps liquid-crystal alignment for a long time form a spacer excellent in dimensional stability on heating and in strength, and can be used in many other applications, and a cured product thereof.
This resin composition contains (A) a (meth)acrylic ester mixture which is formed by reacting (meth)acrylic acid with (I) a mixture containing (a) dipentaerythritol, (b) tripentaerythritol, (c) tetrapentaerythritol, and optionally (d) pentaerythritol.
Inventors:
WADA MORIO
TAKAHASHI HITOSHI
YOKOSHIMA MINORU
TAKAHASHI HITOSHI
YOKOSHIMA MINORU
Application Number:
JP2001011008A
Publication Date:
July 31, 2002
Filing Date:
January 19, 2001
Export Citation:
Assignee:
NIPPON KAYAKU KK
NIPPON KAYAKU FUKUYAMA KK
NIPPON KAYAKU FUKUYAMA KK
International Classes:
G02F1/1339; C08F2/50; C08F220/20; C08F290/06; (IPC1-7): C08F220/20; C08F2/50; C08F290/06; G02F1/1339
Domestic Patent References:
JPH10139830A | 1998-05-26 | |||
JPH09138983A | 1997-05-27 | |||
JPH0451242A | 1992-02-19 | |||
JPH0497362A | 1992-03-30 | |||
JP2000190430A | 2000-07-11 |