To obtain a resin composition for dielectrics which excels in heat resistance, electrical properties, water absorption properties in the use for semi conductor and can lower the dielectric constant, to prepare a dielectric using the same.
The resin composition for dielectrics having, as the essential components, a polyamide having a repeating unit of formula (1) (wherein L and M are integers with meet the following relationships: L>0, M≥0, 2≤L+M≤1,000, and 0.05≤L/(L+M)≤1; and as the concrete examples of X, Y, and Z, X is 2,4-diaminoresorcinol; Y is 2,2'-diethynyl-4,4'-biphenyl dicarboxylic acid; and Z is isophthalic acid) and an oligomer is subjected to heat treatment to effect condensation and crosslinking reaction with the resultant formation of the dielectric having a polybenzoxazone as the major structure and, simultaneously, fine pores.
