PURPOSE: To obtain a resin composition which is reduced in water absorbency and excellent in dimensional stability and suitability for solder reflowing and is useful as the material of an electronic part to be subjected to front mounting by mixing given amounts of a nylon 46 resin, an aromatic polyamide resin, a halogenated compound, antimony oxide, and glass fibers.

CONSTITUTION: This resin composition comprises 20-83wt.% blend of a nylon 46 resin and an aromatic polyamide resin (e.g., one obtained from terephthalic acid, isophthalic acid, and hexamethylenediamine), 5-30wt.% halogenated compound (e.g., brominated PS), 2-10wt.% antimony oxide, and 10-40wt.% glass fibers, the weight ratio of the resin to the blend being 0.01 to 0.25.