Title:
RESIN COMPOSITION FOR ELECTRONIC MEMBER
Document Type and Number:
Japanese Patent JP2524957
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject composition having improved mechanical properties and excellent a heat resistance and dielectric properties by incorporating a specific copolymer into a blend of a polyetherimide and a poly(phenylene ether) to improve the compatibility there between.
CONSTITUTION: A copolymer (a) of a maleic anhydride compound and a vinyl compound is incorporated into a blend of a polyetherimide (b) represented by formula I (wherein (n) is 1-1,000; R1 is the group represented by formula II or III, etc.; and R. is the group represented by formula IV or V, etc.) and a poly(phenylene ether) (c) represented by formula VI (wherein (n) is 1-1,000 and Y1 to Y4 each is H or CH3) to obtain the objective composition, which can retain the excellent heat resistance of the polyetherimide (b) and have higher dielectric properties than the polyetherimide (b). The polymers (b) and (c), which are incompatible, can be well compatibilized by the incorporation of the polymer (a) in an appropriate amount in the wide range of about 0.1-50 pts.wt. The composition has greatly improved mechanical properties accordingly.
Inventors:
WATANABE IKUE
Application Number:
JP18561793A
Publication Date:
August 14, 1996
Filing Date:
June 28, 1993
Export Citation:
Assignee:
KOSUMO SOGO KENKYUSHO KK
KOSUMO SEKYU KK
KOSUMO SEKYU KK
International Classes:
C08K5/54; C08K7/04; C08L33/02; C08L35/00; C08L71/12; C08L79/08; (IPC1-7): C08L71/12; C08K5/54; C08K7/04; C08L35/00; C08L79/08
Domestic Patent References:
| JP23446A | ||||
| JP232880A | ||||
| JP5179132A | ||||
| JP59500723A |
Attorney, Agent or Firm:
Kubota Chikashi (1 person outside)