RESIN COMPOSITION FOR ELECTRONIC MEMBER

Title:

RESIN COMPOSITION FOR ELECTRONIC MEMBER

Document Type and Number:

Japanese Patent JPH07118529

Kind Code:

A

Abstract:

PURPOSE: To provide the title compsn. which has a low relative permittivity, a low dissipation factor, a high heat resistance, high mechanical strengths. and a good thermal conductivity and is suitable for a circuit board material of an electronic apparatus.

CONSTITUTION: The compsn. contains a matrix resin comprising a polyetherimide, a polyphenylene ether, and an arom. vinyl resin and a whisker represented by the general formula: aAxOy.bB2O3 (1≤a≤9; 1≤b≤9; A is a di- or trivalent element; and x=y=1, or x=2 and y=3) in an amt. of the whisker of 5-60wt.% based on the sum of the matrix resin and the whisker.

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Inventors:

KADODE HIROYUKI
TASAKA TAKIO
WATANABE IKUE
KIMURA TAKAO

Application Number:

JP22731194A

Publication Date:

May 09, 1995

Filing Date:

August 29, 1994

Export Citation:

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Assignee:

OTSUKA CHEMICAL CO LTD
COSMO SOGO KENKYUSHO KK

International Classes:

C01B35/10; C08K7/00; C08K7/08; C08L25/04; C08L71/12; C08L73/00; C08L79/08; H01B3/00; H05K1/03; (IPC1-7): C08L79/08; C01B35/10; C08K7/08; C08L25/04; C08L71/12

Domestic Patent References:

JPH05179140A	1993-07-20
JPH0532880A	1993-02-09
JPH04153264A	1992-05-26
JPH06220249A	1994-08-09
JPH05237398A	1993-09-17
JPS63108606A	1988-05-13
JPH02166134A	1990-06-26
JPH03502107A	1991-05-16

Attorney, Agent or Firm:

Kubota Chikashi (1 person outside)

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