Title:
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2017031371
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for encapsulating a semiconductor suppressing detachment of hydrolyzable chlorine of an epoxy resin and excellent in moisture resistant credibility.SOLUTION: There is provided a resin composition for encapsulating a semiconductor containing (A) an epoxy resin, (B) a phenol curing agent, (C) a curing accelerator, (D) spherical silica and (E) tri-substituted phosphine oxide or tri-substituted phosphine sulfide represented by the following formula (1) of 0.03 to 0.5 mass% in the resin composition for encapsulating the semiconductor. (1), where X represents an oxygen atom or a sulfur atom, R, Rand Rrepresent an aromatic group or an aliphatic group which may have a substituent and these groups may be same or different each other.SELECTED DRAWING: None
Inventors:
YAMANE TOSHIYUKI
IMOTO SAE
MAEDA TAKESHI
IMOTO SAE
MAEDA TAKESHI
Application Number:
JP2015155206A
Publication Date:
February 09, 2017
Filing Date:
August 05, 2015
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
C08L63/00; C08G59/62; C08K5/5397; C08K5/5398; C08K7/18; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office
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