Title:
RESIN COMPOSITION FOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE BASED ON THE SAME
Document Type and Number:
Japanese Patent JP2018168217
Kind Code:
A
Abstract:
To provide a resin composition for encapsulation excellent in reliability of a semiconductor device such as electrical reliability during storage at high temperature.SOLUTION: A resin composition for encapsulation comprises an epoxy resin, a hardener, an inorganic filler, an ion scavenger, and a thermoplastic resin. The thermoplastic resin comprises a structural unit represented by the general formula (1) in the figure, where Rto Reach independently represent hydrogen or a C1-3 organic group.SELECTED DRAWING: None
Inventors:
HARADA TAKAHIRO
Application Number:
JP2017064715A
Publication Date:
November 01, 2018
Filing Date:
March 29, 2017
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L63/00; C08K3/00; C08L15/00; C08L45/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2016008240A | 2016-01-18 | |||
| JP2008007692A | 2008-01-17 | |||
| JP2000309678A | 2000-11-07 | |||
| JP2016166373A | 2016-09-15 | |||
| JP2009091537A | 2009-04-30 | |||
| JP2008195874A | 2008-08-28 | |||
| JP2013182154A | 2013-09-12 |
Foreign References:
| WO2016104144A1 | 2016-06-30 |
Attorney, Agent or Firm:
Shinji Hayami