Title:
RESIN COMPOSITION FOR EXTRUSION MOLDED SHEET AND ELECTRICAL INSULATION BOARD
Document Type and Number:
Japanese Patent JPH0326752
Kind Code:
A
Abstract:
PURPOSE:To obtain a composition giving an insulation board having smooth surface and high elastic modulus, exhibiting little anisotropy of mechanical properties in MD and TD directions of the sheet, punchable at a low temperature and having high heat-resistance by compounding a polyester with an inorganic compound, a copolymer and a reinforcing material. CONSTITUTION:The objective composition is produced by compounding (A) 100 pts.wt. of a polyester containing >=80mol% of ethylene terephthalate recurring unit with (B) 5-30 pts.wt. of an inorganic compound having an average particle diameter of <=50mum. (C) 0.1-15 pts.wt. of a copolymer composed of 80-99wt.% of an alpha-olefin and 1-20wt.% of glycidyl methacrylate or glycidyl acrylate and (D) 1-10 pts.wt. of a fibrous reinforcing material. The composition is extrusion molded to form a sheet, which is heat-treated to raise the crystallinity to >=10% and used as an insulation board. The component D is preferably glass fiber of 0.3-4mm long.
Inventors:
YAGI TAKUJI
TANIMOTO KENICHI
OKUBO MAKOTO
KAMIYA KENJI
OKUMURA SHINJI
NAKAYAMA YASUKI
TANIMOTO KENICHI
OKUBO MAKOTO
KAMIYA KENJI
OKUMURA SHINJI
NAKAYAMA YASUKI
Application Number:
JP16175189A
Publication Date:
February 05, 1991
Filing Date:
June 24, 1989
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C08J5/04; C08K3/00; C08K7/14; C08L67/00; C08L67/02; H01B3/42; (IPC1-7): C08J5/04; C08K3/00; C08K7/14; C08L67/02; H01B3/42
Next Patent: POLYCARBONATE MOLDING COMPOUND