RESIN COMPOSITION AND FILM FORMING MATERIAL THEREOF

Title:

RESIN COMPOSITION AND FILM FORMING MATERIAL THEREOF

Document Type and Number:

Japanese Patent JP2003192910

Kind Code:

A

Abstract:

To provide a resin composition having an improved reliability by reducing the amount of an oozed defoaming agent around a resin film, and to provide a resin film thereof.

This resin composition having a thixotropic property is obtained by a treatment wherein a solvent treating liquid, an inorganic filler and a defoaming agent are heated and dispersed into a resin solution.

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Inventors:

ONOSE KATSUHIRO
HIRATA TOMOHIRO
KANEKO SUSUMU

Application Number:

JP2001396682A

Publication Date:

July 09, 2003

Filing Date:

December 27, 2001

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

C08L101/00; C08K3/00; C08L83/04; C09D11/033; C09D11/10; C09D11/102; C09D177/00; C09D179/08; C09D183/04; C09D201/00; (IPC1-7): C08L101/00; C08K3/00; C08L83/04; C09D11/10; C09D177/00; C09D179/08; C09D183/04; C09D201/00

Attorney, Agent or Firm:

Hajime Tsukuni (1 person outside)

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