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Title:
RESIN COMPOSITION AND FILM FORMING MATERIAL COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP2006348178
Kind Code:
A
Abstract:

To provide a resin composition improving defoaming mark and pin hole appearing after screen printing, enhancing moisture resistance, printability and to provide a film forming material comprising the same.

The invention relates to the resin composition comprising three kind of inorganic fillers with different average particle diameter in a predetermined mixing ratio, and the film forming material comprising the same.


Inventors:
ONOSE KATSUHIRO
HIRATA TOMOHIRO
KANEKO SUSUMU
Application Number:
JP2005176315A
Publication Date:
December 28, 2006
Filing Date:
June 16, 2005
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L101/00; C08K3/00; C08L77/00; C08L79/08; C09D7/12; C09D177/00; C09D179/08
Domestic Patent References:
JPH0753914A1995-02-28
JPH10195335A1998-07-28
JP2005048030A2005-02-24
JP2005113014A2005-04-28
JP2002194284A2002-07-10
JPH02135251A1990-05-24
JPH0397765A1991-04-23
JP2003129001A2003-05-08



 
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