Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION AND FILM-FORMING MATERIAL COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP2007284468
Kind Code:
A
Abstract:

To provide a resin composition improving fluidity by mixing a resin solution of a polyimide resin, a polyamide-imide resin or a polyamide resin and a modified polyimide resin, polyamide-imide resin or polyamide resin with inorganic fillers having different average particle diameters and further improving the printing operation efficiency without producing defoamed marks or pinholes when bubbles included during screen printing are defoamed and to provide a film-forming material comprising the resin composition.

The resin composition is obtained by combining the resin solution with the two or more kinds of inorganic fillers having the different average particle diameters. The film-forming material comprises the resin composition.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
ONOSE KATSUHIRO
HIRATA TOMOHIRO
KANEKO SUSUMU
Application Number:
JP2006109689A
Publication Date:
November 01, 2007
Filing Date:
April 12, 2006
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L79/08; C08K3/00; C08K3/34; C08L77/00; C09D7/12; C09D177/00; C09D179/08
Domestic Patent References:
JP2006348178A2006-12-28
JPH07331068A1995-12-19
JPH10265571A1998-10-06
JPH11310754A1999-11-09
JPS63270773A1988-11-08
JP2001302807A2001-10-31
JP2002012664A2002-01-15
JP2006152017A2006-06-15