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Title:
RESIN COMPOSITION AND FILM USING THE SAME
Document Type and Number:
Japanese Patent JP2005225997
Kind Code:
A
Abstract:

To provide a resin composition having excellent heat resistance, optical characteristics and mechanical characteristics; and to provide an optical part such as a transparent electroconductive film base, a TFT substrate, a substrate for a liquid crystal display, a substrate for an organic EL display, a substrate for electronic paper, a substrate for a solar battery, a substrate for an optical disc, an optical waveguide, an optical fiber, a lens and a touch panel, an optical film, and a flat panel display using the optical film base as the substrate by using the resin composition.

The resin composition contains a chemical structure represented by general formula (1) (wherein, R1 to R4 are each independently a hydrogen atom or a substituent; R5 and R6 are each independently a substituent; m and n are each an integer of 0-4; with the proviso that when m and/or n is ≥2, R5 and/or R6 is the same or different and R5 and R6 may form a 5- to 7-membered ring by bonding to each other) in the main chain of a polymer.


Inventors:
TAKAMOTO TETSUFUMI
UCHIDA OSAMU
Application Number:
JP2004036739A
Publication Date:
August 25, 2005
Filing Date:
February 13, 2004
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G02F1/1333; C08G18/32; C08G18/76; C08G63/185; C08G64/06; C08G69/26; C08G71/04; C08G73/10; G02B1/04; H01L51/50; H05B33/02; H05B33/14; (IPC1-7): C08G64/06; C08G18/32; C08G18/76; C08G63/185; C08G69/26; C08G71/04; C08G73/10; G02B1/04; G02F1/1333; H05B33/02; H05B33/14
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes