Title:
RESIN COMPOSITION AND FILM
Document Type and Number:
Japanese Patent JP2021195435
Kind Code:
A
Abstract:
To provide a resin composition which can suppress thermal degradation of an additive, and a film containing the same.SOLUTION: A resin composition has a blending ratio of an additive to a resin having a partial structure represented by the following general formula (I) or (II) of 50 mass% or less. In the formula (I), QA represents an ester bond represented in the formula; RA represents a substituent; n1 represents an integer of 1 to 5; * represents a bonding site with a balance of the repeating unit; and ** represents a bonding site with a phenyl group in the formula. In the formula (II), QB represents a connection group or a single bond other than an ester bond represented by QA in the formula (I); RB represents a substituent; n2 represents an integer of 1 to 5; and * represents a bonding site with a balance of the repeating unit. At least one RB represents a hydroxyl group.SELECTED DRAWING: None
Inventors:
MIYOSHI HANAE
FURUKAWA SHIGEKI
FURUKAWA SHIGEKI
Application Number:
JP2020102135A
Publication Date:
December 27, 2021
Filing Date:
June 12, 2020
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
C08L33/04; C08F10/00; C08F12/04; C08F14/00; C08F20/10; C08F20/30; C08F20/52; C08J7/05; C08K5/00; C08L23/02; C08L25/02; C08L27/00; C08L33/24; C08L33/26
Attorney, Agent or Firm:
Kurata Masatoshi
Nobuhisa Nogawa
Tadashi Inoue
Naoki Kono
Shigeru Iino
Sanae Kaneko
Nobuhisa Nogawa
Tadashi Inoue
Naoki Kono
Shigeru Iino
Sanae Kaneko