Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION FOR FORMING FILM
Document Type and Number:
Japanese Patent JP2001288311
Kind Code:
A
Abstract:

To obtain a resin composition for forming a film having excellent balance of physical properties such as mechanical strengths, heat resistance, blocking resistance, slipperiness, transparency, etc., and slight discoloration with time.

This resin composition is obtained by compounding 100 pts.wt. of a copolymer (I) of ethylene and a 3-18C α-olefin having 0.890-0.940 g/cm3 density and 0.3-20 g/10 minutes melt flow rate with 1-50 pts.wt. of a low-density polyethylene (II) produced by a high-pressure radical polymerization method, 0.01-0.15 pt.wt. of a phenol-based heat stabilizer (IIIa), 0.005-0.3 pt.wt. of the total of a phosphorus-based heat stabilizer (IIIb) and 3-phenylbenzofuran-2-one (IIIc), 0.05-1.0 pt.wt. of an antiblocking agent (IV) and 0.02-1.0 pt.wt. of a fatty acid amide.


Inventors:
ORIGASA YUICHI
KAWAKAMI SHIGENOBU
Application Number:
JP2000102223A
Publication Date:
October 16, 2001
Filing Date:
April 04, 2000
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JAPAN POLYOLEFINS CO LTD
International Classes:
C08J5/18; C08K3/34; C08K5/13; C08K5/1535; C08K5/20; C08K5/49; C08K5/524; C08L23/08; (IPC1-7): C08L23/08; C08K3/34; C08K5/13; C08K5/1535; C08K5/20; C08K5/49; C08K5/524
Attorney, Agent or Firm:
Masatake Shiga (6 people outside)