RESIN COMPOSITION FOR FORMING HEAT INSULATING LAYER, TRANSPARENT HEAT INSULATING LAYER AND TRANSPARENT HEAT INSULATING FILM

Japanese Patent JP2015189902

A

PROBLEM TO BE SOLVED: To provide a transparent heat insulating layer and a transparent heat insulating film having a small thermal conductivity, excellent heat insulating properties and high transparency and to provide a resin composition for forming a heat insulating layer for forming them.SOLUTION: There is provided a resin composition for forming a heat insulating layer which comprises silica fine particles (A) whose surfaces are modified with a phenyl group, a polysilane (B) and an ionization radiation curable material (C), wherein the content of the polysilane (B) is 10 mass% or less of the total solid content and the content of the ionization radiation curable material (C) is 4 mass% or more and 50 mass% or less of the total solid content. The structural unit of the polysilane has R1 and R2 as a functional group, R1 and R2 may be the same or different from each other and are selected from the group consisting of an aryl group, a hydrocarbon group, a hydroxy group, an alkoxy group, a cycloalkyloxy group, an aryloxy group, an aralkyloxy group, an amino group, a silyl group and a halogen atom, and at least one of R1 and R2 is an aryl group.

NAKAYAMA YUMI

JP2014069432A

November 02, 2015

March 28, 2014

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TOPPAN PRINTING CO LTD

C08F2/44; B32B7/02; B32B27/00; C08F289/00; C08F292/00

JP2012056167A	2012-03-22
JP2006199854A	2006-08-03
JP2002348357A	2002-12-04

WO2010001875A1

2010-01-07

Patent business corporation Ogasawara patent office

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