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Title:
RESIN COMPOSITION HAVING EXCELLENT HEAT CYCLE CHARACTERISTIC
Document Type and Number:
Japanese Patent JPS5626939
Kind Code:
A
Abstract:

PURPOSE: To provide titled resin compsn. suitable for use as a raw material for the plating of products, by a method wherein at least one resin selected from a vinyl chloride resin, an olefin resin and a phenylene oxide resin is blended with an organosilicon cpd.

CONSTITUTION: (a) 100pts.wt. of at least one resin selected from a vinyl chloride resin, an olefin resin and a phenylene oxide resin is blended with (b) 0.05W3pts.wt. of an organosilicon cpd. (e.g. polydimethylsiloxane, polymethylethylsiloxane, etc.) such as a polysiloxane of formula I (wherein R1WR4 are lower alkyl, aryl), a silane cpd. of the formula R1R2R3R4Si or an organohalosilane of formula II (wherein n= 1W3; R is lower alkyl, aryl; X is halogen) to obtain titled resin compsn.

EFFECT: The occurrence of blistering phenomenon after plating can be prevented.


Inventors:
SAKANO HAJIME
KODAMA MIKIO
SHIYOUJI TOSHIHIRO
Application Number:
JP10096779A
Publication Date:
March 16, 1981
Filing Date:
August 08, 1979
Export Citation:
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Assignee:
SUMITOMO NAUGATUCK
International Classes:
C08L23/00; C08K5/54; C08K5/5419; C08L1/00; C08L7/00; C08L21/00; C08L23/02; C08L27/00; C08L27/06; C08L33/00; C08L33/02; C08L51/00; C08L51/02; C08L51/08; C08L71/00; C08L71/12; C08L77/00; C08L83/04; C08L101/00; (IPC1-7): C08K5/54; C08L23/02; C08L27/06; C08L51/08; C08L71/04; C08L83/04
Domestic Patent References:
JPS5117947A1976-02-13
JPS5117956A1976-02-13
JPS5231213A1977-03-09
JP40019586A
JPS4918460A1974-02-18
JPS4719093A
JP39014506A
JPS5025933A1975-03-18
JP30007441A
JPS595212A1984-01-12
JPS54154444A1979-12-05