Title:
RESIN COMPOSITION, HEAT RADIATION MEMBER AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2023127557
Kind Code:
A
Abstract:
To provide a resin composition with excellent dispersibility of thermally conductive particles, suitable for producing a molded article with excellent heat dissipation, and to provide a heat radiation member and an electronic apparatus each including the resin composition.SOLUTION: A resin composition includes a resin component, a dispersant, and thermally conductive particles. The dispersant includes a constitutional unit (A), which is at least one selected from the group consisting of constitutional units (A-1), (A-1'), (A-2), (A-2') represented by the following formulae.SELECTED DRAWING: None
Inventors:
SHIMOJITOSHO AKIRA
OGATA TAKEHIRO
OGATA TAKEHIRO
Application Number:
JP2023027520A
Publication Date:
September 13, 2023
Filing Date:
February 24, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L101/00; C08L9/00; C08L33/06; C08L63/00; C08L67/00; C08L83/04; C09K5/10
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus