Title:
RESIN COMPOSITION, HEAT SEAL AGENT CONTAINING THE SAME AND HEAT SEAL FILM
Document Type and Number:
Japanese Patent JP2016088983
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition having heat seal performance and no sorption property of a flavor component, a heat seal agent containing the resin composition and a heat seal film having a thermal fusion layer containing the heat seal agent as an innermost layer.SOLUTION: There is provided a resin composition by blending a specific small amount of an ethylene-α-olefin copolymer (B) with an ethylene-vinyl ester copolymer saponified product having a structural unit represented by the formula (1) with a content weight ratio of (A)/(B)=98/2 to 92/8. (1), where Rto Rare each independently H or an organic group, X is a single bond or a binding chain, and Rto Rare each independently H or an organic group.SELECTED DRAWING: None
Inventors:
INOUE KOTA
SHIMIZU AYANO
SHIMIZU AYANO
Application Number:
JP2014222630A
Publication Date:
May 23, 2016
Filing Date:
October 31, 2014
Export Citation:
Assignee:
NIPPON SYNTHETIC CHEM IND CO LTD:THE
International Classes:
C08L29/04; B32B27/32; B65D65/40; C08L23/08; C08L23/26
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