Title:
RESIN COMPOSITION AND HEAT-SHRINKABLE FILM THEREOF
Document Type and Number:
Japanese Patent JP2004238467
Kind Code:
A
Abstract:
To obtain a heat-shrinkable film which has low natural shrinkage in preservation, high shrinkage in heating, low density, excellent hygiene and excellent sebum whitening properties.
The resin composition comprises (A) >90 wt.% and ≤98 wt.% of a resin having an alicyclic structure in the molecule and (B) ≥2 wt.% and <10 wt.% of a polyethylene-based resin having ≤0.92 g/cm3 density and ≥2 g/10 minutes MFR (190°C, 2.16 kg load). The heat-shrinkable film is obtained by forming a film using the composition and stretching the film. The heat-shrinkable film is obtained by stretching a laminated film equipped with the resin composition on the outermost layer.
Inventors:
Kaneko, Kazuyoshi
Hirose, Toshiyuki
Hirose, Toshiyuki
Application Number:
JP2003000028496
Publication Date:
August 26, 2004
Filing Date:
February 05, 2003
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
C08J5/18; B29C61/06; B32B27/00; C08L23/00; C08L65/00; B29K105/02; B29L7/00; C08J5/18; B29C61/06; B32B27/00; C08L23/00; C08L65/00; (IPC1-7): C08L23/00; B29C61/06; B32B27/00; C08J5/18; C08L65/00
