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Title:
RESIN COMPOSITION AND HEAT-SHRINKABLE FILM
Document Type and Number:
Japanese Patent JP2010116499
Kind Code:
A
Abstract:

To provide a resin composition giving a heat-shrinkable film having suppressed surface roughness of the film while suppressing drooling near a die in extrusion molding.

The resin composition includes (A) a cyclic olefin resin, (B) a polyolefin and (C) a fluororesin.


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Inventors:
ABE SHOTA
KANEKO KAZUYOSHI
SHIBUYA ATSUSHI
Application Number:
JP2008291367A
Publication Date:
May 27, 2010
Filing Date:
November 13, 2008
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L45/00; B32B7/02; B32B27/00; C08J3/22; C08L23/00; C08L27/12; C08L65/00
Domestic Patent References:
JP2007150094A2007-06-14
JPH1112397A1999-01-19
JP2008179687A2008-08-07
JPH02255848A1990-10-16
JPH03215541A1991-09-20
JP2009138029A2009-06-25
Foreign References:
WO2005028553A12005-03-31
Other References:
JPN6012067995; カタログ：ＴＯＰＡＳ（Ｒ）　包装用材料 , 20121220, 第９頁, ポリプラスチックス株式会社
Attorney, Agent or Firm:
Shinji Hayami
Koji Sato



 
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