To obtain a resin composition having excellent infrared absorption property, heat resistance, low water absorption and high transparency and an infrared absorbing molding using the same.

The resin composition comprises an epoxy group-containing cyclic olefin-based resin (A) and an infrared absorbing body (B). Preferably the cyclic olefin-based resin is a polynorbornene resin and the infrared absorbing body is a metal complex compound. The infrared absorbing molding comprises the resin composition as a main component.