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Patent Searching and Data


Title:
RESIN COMPOSITION FOR INJECTION MOLDING
Document Type and Number:
Japanese Patent JP07330984
Kind Code:
A
Abstract:

PURPOSE: To obtain a resin composition which can give a molding excellent in rigidity and impact resistance by adding aluminum borate whiskers to a resin component comprising a specified PP resin and a specified PE resin.

CONSTITUTION: This resin composition is prepared by adding 5-80 pts.wt. aluminum borate whiskers having a diameter of 0.1-3μm and an aspect ratio of 10-50 to 100 pts.wt. resin component comprising 70-97wt.% highly crystalline PP resin selected between a propylene homopolymer having an isotactic pentad fraction P in the range: ≥2P≥0.955 and a melt flow rate (at 230°C under a load of 2.16kg) of 2-30g/10min and an ethylene/propylene copolymer having an isotactic pentad fraction P in the PP part in the range: 1≥P≥0.955, a melt flow rate of 2-30g/10min and an ethylene content of 0.5-15wt.% and 30-3wt.% PE resin prepared by polymerization in the presence of a catalyst comprising a metallocene compound containing a tetravalent transition metal.


Inventors:
Yamamoto, Kazuyoshi
Shibayama, Koichi
Ogasa, Masao
Application Number:
JP1994000127589
Publication Date:
December 19, 1995
Filing Date:
June 09, 1994
Export Citation:
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Assignee:
SEKISUI CHEM CO LTD
International Classes:
C08K7/04; C08K7/00; C08K7/08; C08L23/00; C08L23/10; C08K7/00; C08L23/00; (IPC1-7): C08L23/10; C08K7/04