Title:
RESIN COMPOSITION, INSULATING FILM GIVEN BY USING THE SAME, SEMICONDUCTOR DEVICE AND ORGANIC ELECTROLUMINESCENT ELEMENT
Document Type and Number:
Japanese Patent JP2004190008
Kind Code:
A
Abstract:
To provide a photosensitive resin composition curable at a low temperature.
This resin composition contains a resin composed of a structural unit expressed by general formula (1) [R1 and R2 are each H, D (deuterium), F, Cl, Br, CF3, a 1-10C alkyl or a 6-20C aryl, and may be identical to or different from each other; or R1 and R2 may be combined with each other to form an organic radical; Ra is a 1-30C monovalent organic group having at least one functional group selected from carboxy, phenolic hydroxy, sulfonic acid, and thiol]. An insulating film is given by using the composition. A semiconductor device and an organic electroluminescent element are each given by using the film.
Inventors:
FUJIWARA TAKENORI
OKUDA RYOJI
MIYOSHI KAZUTO
OKUDA RYOJI
MIYOSHI KAZUTO
Application Number:
JP2003368530A
Publication Date:
July 08, 2004
Filing Date:
October 29, 2003
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
G03F7/023; C07D207/448; C07D207/452; C07D209/58; C08F232/00; C08K5/00; C08L35/00; G03F7/033; H01L21/312; H01L21/768; H01L23/522; H01L51/50; H05B33/14; H05B33/22; (IPC1-7): C08L35/00; C08F232/00; C08K5/00; G03F7/023; G03F7/033; H01L21/312; H01L21/768; H05B33/14; H05B33/22
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