Title:
樹脂組成物およびその架橋体
Document Type and Number:
Japanese Patent JP6810621
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a crosslinked body excellent in dielectric characteristics, heat resistance and mechanical characteristics in a high frequency region suitable for an interlayer insulation film for circuit board and a circuit board for a highly integrated arithmetic device.SOLUTION: A resin composition contains a cyclic olefin copolymer (P), and one or two or more resins (Q) selected from the group consisting of polyphenylene ether, a polyimide resin, polyurethane, polyether ether ketone, polybutylene terephthalate, a liquid crystal polymer, a maleimide resin and a polybutadiene resin. A mass ratio ((Q)/(P)) of the content of the resin (Q) to the content of the cyclic olefin copolymer (P) in the resin composition is 0.1 or more and 5 or less.SELECTED DRAWING: None
Inventors:
Junji Saito
Kotaro Asahina
Hirohiko Murase
Haruka Saito
Kotaro Asahina
Hirohiko Murase
Haruka Saito
Application Number:
JP2017016059A
Publication Date:
January 06, 2021
Filing Date:
January 31, 2017
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08L45/00; B32B27/00; C08J5/04; C08L101/00; H05K1/03
Domestic Patent References:
| JP2014015511A |
Attorney, Agent or Firm:
Shinji Hayami