Title:
RESIN COMPOSITION, ITS MANUFACTURING METHOD, COATING OBTAINED USING THE SAME, AND PACKAGE
Document Type and Number:
Japanese Patent JP2005146070
Kind Code:
A
Abstract:
To provide a resin composition which can adjust the amount of electrostatic charge of itself corresponding to charging tendency of an object, such as a sealing agent for electronic devices which is charged by friction with the resin composition, by static electricity generated by contact or friction between the resin composition and the object, and a coating.
The resin composition comprises (a) a thermoplastic resin comprising at least one selected from a poly(meth)acrylate resin and a polyvinyl acetate resin and (b) a silicone resin. The coating comprises the resin composition.
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Inventors:
Kosugi, Kazuhiro
Fujimura, Tetsuo
Shimizu, Mikio
Fujimura, Tetsuo
Shimizu, Mikio
Application Number:
JP2003000383815
Publication Date:
June 09, 2005
Filing Date:
November 13, 2003
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
B65D65/42; B65D85/86; C08J3/21; C08L31/04; C08L33/06; C08L83/04; C09D131/04; C09D133/06; C09D183/04; B65D65/38; B65D85/86; C08J3/20; C08L31/00; C08L33/00; C08L83/00; C09D131/00; C09D133/06; C09D183/04; (IPC1-7): C08L33/06; B65D65/42; B65D85/86; C08J3/21; C08L31/04; C08L83/04; C09D131/04; C09D133/06; C09D183/04