Title:
樹脂組成物およびその製造方法
Document Type and Number:
Japanese Patent JP5660324
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition with further improved thermal conductivity and degree of elasticity while maintaining high insulation property, and a method for producing the same.SOLUTION: The resin composition includes a conductive nanofiller (A) and two or more resins (B), wherein the resin composition includes a continuous phase formed by a resin (B) with highest compatibility with the conductive nanofiller (A) among the two or more resins (B), and a dispersing phase formed by a resin (B1) except the resin (B), wherein the dispersing phase includes the conductive nanofiller (A) and characterized in that when the ratio of the dispersing phase to the whole resin compositions is X (unit: volume%) and the ratio of the conductive nanofiller (A) to the conductive nanofiller (A) included in the dispersing phase is Y (unit: volume%), the ratio Y/X shall be 1.0 or over.
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Inventors:
森下 卓也
福森 健三
松下 光正
片桐 好秀
福森 健三
松下 光正
片桐 好秀
Application Number:
JP2011136296A
Publication Date:
January 28, 2015
Filing Date:
June 20, 2011
Export Citation:
Assignee:
株式会社豊田中央研究所
International Classes:
C08L101/00; B82Y30/00; C08J3/20; C08K3/04; C08K5/00
Attorney, Agent or Firm:
Patent business corporation cent Crest international patent firm