Title:
RESIN COMPOSITION AND ITS USE
Document Type and Number:
Japanese Patent JP2004244451
Kind Code:
A
Abstract:
To obtain a resin composition which shows controlled thickness dispersion in the TD (width direction) in film-forming such as blown-film extrusion and gives a molded product such as a film or a sheet having uniform thickness; and to provide a mono- or multi-layer structure using the resin composition.
The resin composition comprises (A) a saponified ethylene-vinyl acetate copolymer, (B) an organic titanate, (C) a boron compound, and (D) a fatty acid metal salt. The multi-layer structure contains at least one layer of the resin composition.
Inventors:
MIYAZUMI NOBUTA
NAGAYAMA HIROTERU
NAGAYAMA HIROTERU
Application Number:
JP2003033257A
Publication Date:
September 02, 2004
Filing Date:
February 12, 2003
Export Citation:
Assignee:
NIPPON SYNTHETIC CHEM IND
International Classes:
B32B27/28; C08K3/38; C08K5/057; C08K5/098; C08L31/04; (IPC1-7): C08L31/04; B32B27/28; C08K3/38; C08K5/057; C08K5/098
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