Title:
RESIN COMPOSITION AND ITS USE
Document Type and Number:
Japanese Patent JPS6153313
Kind Code:
A
Abstract:
PURPOSE: The titled composition useful as an adhesive for laminate especially a vinyl alcohol film to a polyester film, etc., having improved bond strength, obtained by polymerizing a specific vinyl monomer in the presence of a vinyl acetal resin.
CONSTITUTION: A vinyl monomer having ≥3C, preferably 3W12C alkyl group (preferably a monomer mixture comprising 50W80wt% of the monomer) is polymerized in the presence of a vinyl acetal resin (preferably butyral derivative), to give the aimed composition.
Inventors:
KONDO SUSUMU
MORIYA TETSUO
MORIYA TETSUO
Application Number:
JP17598384A
Publication Date:
March 17, 1986
Filing Date:
August 23, 1984
Export Citation:
Assignee:
NIPPON SYNTHETIC CHEM IND
International Classes:
C08F261/00; C08F261/12; C08L7/00; C08L21/00; C08L23/00; C08L29/00; C08L29/14; C08L33/00; C08L33/02; C08L101/00; C09J151/00; (IPC1-7): C08F261/12; C08L29/14; C09J3/14