RESIN COMPOSITION FOR LAMINATE, PREPREG AND MULTILAYER LAMINATE

Title:

RESIN COMPOSITION FOR LAMINATE, PREPREG AND MULTILAYER LAMINATE

Document Type and Number:

Japanese Patent JP2003313420

Kind Code:

A

Abstract:

To provide a resin composition for laminates that can intrude into a space between the inner layer circuits to fully fill the space and secure an adequate resin flow in the thermal compression molding for manufacturing laminates.

This resin composition for laminates comprises at least one of a polyphenylene oxide resin and a polyimide resin, and a spherical molten silica. The silica contained in the composition has an average particle size of 1-7 μm and is 5-20 mass% based in the total of the resin composition.

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Inventors:

ITO NAOKI
KOMORI KIYOTAKA
WATANABE TATSUYA

Application Number:

JP2002121392A

Publication Date:

November 06, 2003

Filing Date:

April 23, 2002

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC WORKS LTD

International Classes:

C08J5/24; C08K3/36; C08L71/12; C08L79/08; (IPC1-7): C08L71/12; C08J5/24; C08K3/36; C08L79/08

Attorney, Agent or Firm:

Keisei Nishikawa (1 person outside)

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