Title:
RESIN COMPOSITION FOR LAMINATE, PREPREG AND LAMINATE
Document Type and Number:
Japanese Patent JP2009001783
Kind Code:
A
Abstract:
To provide a resin composition for a laminate, having high heat resistance, low hygroscopicity, low dielectric characteristics and excellent flame retardancy.
Using a resin composition which contains polymaleimide resin represented by formula (1) and a compound for a laminate capable of cross-linking reaction with the polymaleimide resin, a prepreg is obtained to produce laminates. In the formula, a plurality of Rs exist respectively independently, and R denotes hydrogen, an alkyl group of 1-5C or a phenyl group. n denotes an average value, representing 1n5.
Inventors:
KUBOKI KENICHI
OSHIMI KATSUHIKO
NAKANISHI MASATAKA
KAWAI KOICHI
SUNAGA TAKAO
OSHIMI KATSUHIKO
NAKANISHI MASATAKA
KAWAI KOICHI
SUNAGA TAKAO
Application Number:
JP2008128246A
Publication Date:
January 08, 2009
Filing Date:
May 15, 2008
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C08L35/00; C08J5/24; C08K5/17; C08K5/315; C08L61/00; C08L63/00
Previous Patent: 文字入力装置
Next Patent: MATERIAL FOR ORGANIC DEVICE, AND LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, F...
Next Patent: MATERIAL FOR ORGANIC DEVICE, AND LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, F...