Title:
樹脂組成物およびその樹脂組成物を用いた積層体
Document Type and Number:
Japanese Patent JP7069976
Kind Code:
B2
Abstract:
To provide a resin composition which satisfactorily adheres to a gas barrier film without using an adhesive such as an anchor coating agent and has high heat resistance, and to provide a laminate using the resin composition.SOLUTION: The resin composition contains 10-80 pts.wt. of a high-density polyethylene (a) having a density of 945 kg/mor more and 970 kg/mor less as measured according to JIS 6922-1 (1997), 5-80 pts.wt. of a polyethylene resin (b) having a density of 890 kg/mor more and 940 kg/mor less as measured according to JIS 6922-1 (1997), and 5-50 pts.wt. of an ethylene-acrylic acid copolymer or an ethylene-(meth)acrylic acid copolymer (c) (the total of (a)-(c) is 100 pts.wt.).SELECTED DRAWING: None
Inventors:
Daisuke Nailmoto
Shingo Koda
Shingo Koda
Application Number:
JP2018069473A
Publication Date:
May 18, 2022
Filing Date:
March 30, 2018
Export Citation:
Assignee:
Tosoh Corporation
International Classes:
B32B9/00; C08L23/06; B32B27/00; B32B27/32; B65D81/38; C08L23/04; C08L23/26; C08L33/02; C08L51/06
Domestic Patent References:
| JP2005501376A | ||||
| JP7097462A | ||||
| JP2013100552A | ||||
| JP2001019810A | ||||
| JP2010253763A | ||||
| JP2003187648A | ||||
| JP2014132530A | ||||
| JP7062158A |
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