Title:
樹脂組成物、積層体、配線板および配線板の製造方法
Document Type and Number:
Japanese Patent JP5087819
Kind Code:
B2
More Like This:
Inventors:
Noriyuki Daito
Application Number:
JP2005103566A
Publication Date:
December 05, 2012
Filing Date:
March 31, 2005
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
H01B3/44; B32B15/08; B32B27/00; C08F299/00; C08K3/36; C08K5/10; C08L45/00; C08L63/00; H01B3/00; H05K3/46
Domestic Patent References:
| JP11340593A | ||||
| JP2001176329A | ||||
| JP11343310A | ||||
| JP2003022711A |