To obtain a resin composition having a low dielectric constant, a low dielectric tangent, heat resistance, and adhesion to conductive materials, and to provide a laminate for high-frequency circuits using the resin composition.
The resin composition is composed of 3-72 pts.wt. of (I) a polymer selected from 4-methyl-1-pentene-based polymers and/or cycloolefin-based copolymers containing at least a monomer component expressed by formula (1) which takes a structure expressed by formula (2) in the polymer, 0.5-50 pts.wt. of (II) a modified poly-α-olefinic polymer having 0.01-10 wt.% of a portion graft-modified with an unsaturated carboxylic acid and/or its derivatives, and 25-90 pts.wt. of (III) an inorganic filler with an average particle diameter of 0.1-100 μm, provided that the total of (I), (II), and (III) is 100 pts.wt.
COPYRIGHT: (C)2005,JPO&NCIPI
Hasegawa
Masashi Tamai
| JP9118811A | ||||
| JP7041618A | ||||
| JP7162111A |
Koji Sato
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