To provide a resin composition excellent in electric properties and adhesion when forming a resin layer of a wiring board, to provide a laminated product excellent in processibility, to provide a wiring board excellent in electric properties, and to provide a method for producing the wiring board.
The resin composition for composing an insulating layer of a wiring board comprises an addition type norbornene-based resin and spherical silica having ≤2 μm average particle diameter as essential components and has ≤60 ppm coefficient of thermal expansion at -50 to 150°C. The spherical silica of the resin composition is ≥50 wt.% in the resin composition and is previously surface treated. The laminated products applied to wiring boards are obtained by laminating a resin layer comprising the resin composition and a carrier film. The method for producing wiring boards comprises a step for forming an insulating layer by using the resin composition, a step for forming a circuit layer, and a step for perforating the insulating layer by laser irradiation.
COPYRIGHT: (C)2008,JPO&INPIT
OKUGAWA YOSHITAKA
HIRATA AKIHIRO
NAKAMURA KENSUKE
DEJIMA HIROHISA
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