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Title:
RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE ORIGINAL PLATE FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE
Document Type and Number:
Japanese Patent JP2010042658
Kind Code:
A
Abstract:

To provide a resin composition for laser engraving having high engraving sensitivity when subjected to laser engraving, and a relief printing plate original plate for the laser engraving of high engraving sensitivity and enabling direct preparation by the laser engraving.

This resin composition for the laser engraving contains (A) a binder polymer of at least one kind selected from the group comprising a vinyl polymer, a polyester, a ployamide, a polyurethane and a polyurea, and (B) a compound satisfying the condition where a temperature bringing 10% of weight reduction rate when conducting thermogravimetric analysis (TGA) of temperature-elevating a mixture obtained by adding 10 mass% to the (A) binder polymer at 20C/min. of temperature elevation speed from an ambient temperature, under a nitrogen atmosphere, is lower by 5-300C compared with that of the single binder, and the relief printing plate original plate for the laser engraving is prepared using the resin composition.


Inventors:
KAWASHIMA TAKASHI
SUGAZAKI ATSUSHI
Application Number:
JP2009059904A
Publication Date:
February 25, 2010
Filing Date:
March 12, 2009
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
B41N1/12; B41C1/05; B41N3/00; C08K3/00; C08L101/00
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda