Title:
RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING SAME
Document Type and Number:
Japanese Patent JP2012066415
Kind Code:
A
Abstract:
To provide a resin composition for laser engraving that gives a relief printing plate having excellent chemical resistance and that has excellent removability of engraving residue, a relief printing plate precursor using the resin composition for laser engraving, a process for making a relief printing plate using the precursor, and a relief printing plate obtained thereby.
The resin composition includes: (Component A) a filler having an ethylenically unsaturated group; (Component B) a polymerizable compound having an ethylenically unsaturated group; and (Component C) a polymerization initiator.
Inventors:
YAMAMOTO OSAO
Application Number:
JP2010211381A
Publication Date:
April 05, 2012
Filing Date:
September 21, 2010
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
B41N1/12; B41C1/05; C08F2/44; C08F290/12; C08F292/00
Domestic Patent References:
JP2010100047A | 2010-05-06 | |||
JP2007164178A | 2007-06-28 | |||
JP2010042657A | 2010-02-25 | |||
JP2006206872A | 2006-08-10 |
Foreign References:
WO2010030013A1 | 2010-03-18 |
Attorney, Agent or Firm:
Yasuhiro Noguchi
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