Title:
樹脂組成物、硬化物の製造方法、硬化物、パターン硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
Document Type and Number:
Japanese Patent JP7363901
Kind Code:
B2
Abstract:
A resin composition comprising the following component (A), the following component (B), and one or more selected from the group consisting of the following component (C) and the following component (D).(A) polyimide, a polyimide precursor, polybenzoxazole, or a polybenzoxazole precursor(B) one or more selected from the group consisting of a compound represented by the following formula (11), a compound represented by the following formula (21), and N-methyl-2-pyrrolidone(C) a rust inhibitor(D) a silane coupling agent
Inventors:
Ayaka Higashi
Satoshi Abe
Kazuya Soejima
Satoshi Abe
Kazuya Soejima
Application Number:
JP2021537526A
Publication Date:
October 18, 2023
Filing Date:
August 08, 2019
Export Citation:
Assignee:
hd micro systems inc.
International Classes:
C08L79/04; C08K5/20; C08K5/3472; C08K5/41; C08K5/541; C08K5/5455
Domestic Patent References:
| JP2016069498A | ||||
| JP2011128358A |
Foreign References:
| WO2018043467A1 | ||||
| WO2017018290A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Peace International Patent Office