Title:
RESIN COMPOSITION, AND METHOD FOR PRODUCING ELEMENT USING THE SAME
Document Type and Number:
Japanese Patent JP2021055049
Kind Code:
A
Abstract:
To provide a resin composition that can form an insulating layer with high dielectric constants and reduced leakage currents.SOLUTION: A resin composition at least has (a) polymer A: a polymer in which a polymer is bound to an inorganic particle having a hydroxy group on the surface, (b) polymer B: a polymer that is not bound to an inorganic particle and has a functional group capable of forming a hydrogen bond with a hydroxy group on the inorganic particle in the polymer A, and (C) a solvent.SELECTED DRAWING: None
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Inventors:
WAKITA JUNJI
OKAMOTO HISAYO
ISOGAI KAZUO
MURASE SEIICHIRO
OKAMOTO HISAYO
ISOGAI KAZUO
MURASE SEIICHIRO
Application Number:
JP2020140659A
Publication Date:
April 08, 2021
Filing Date:
August 24, 2020
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L101/02; C08G77/14; C08L83/10; H01L21/312; H01L29/786