Title:
PC/ASA RESIN COMPOSITION AND RESIN MOLDED ARTICLE THEREOF
Document Type and Number:
Japanese Patent JP2016121223
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a PC/ASA resin composition good in molding appearance and excellent in creak sound reduction effect without the need for hard coating after molding and a resin molded article thereof.SOLUTION: A PC/ASA resin composition contains 50 to 90 pts.wt. of (A) a polycarbonate resin (PC), 50 to 10 pts.wt. of ASA resin (ASA) and 0.5 to 20 pts.wt. of (C) a graft copolymer having polyethylene as a main chain and polystyrene as a side chain based on total 100 pts.wt. of the (A) component and the (B) component.SELECTED DRAWING: None
Inventors:
MIMA KAZUAKI
TASAKA TOMOHISA
TASAKA TOMOHISA
Application Number:
JP2014260225A
Publication Date:
July 07, 2016
Filing Date:
December 24, 2014
Export Citation:
Assignee:
NOF CORP
International Classes:
C08L69/00; C08L51/00; C08L51/06
Domestic Patent References:
| JPH08283494A | 1996-10-29 | |||
| JP2000034384A | 2000-02-02 | |||
| JP2000038513A | 2000-02-08 | |||
| JP2000063654A | 2000-02-29 | |||
| JPH04211447A | 1992-08-03 | |||
| JPH0517667A | 1993-01-26 | |||
| JPH0532876A | 1993-02-09 | |||
| JPH0517680A | 1993-01-26 |
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