Title:
RESIN COMPOSITION AND MOLDING
Document Type and Number:
Japanese Patent JP2023062297
Kind Code:
A
Abstract:
To provide a resin composition which is excellent in impact resistance and toughness under a low temperature condition, and is also excellent in processability.SOLUTION: A resin composition contains: a modified block copolymer of a component (I) obtained by bonding an amino group to a block copolymer having a polymer block (A) mainly containing at least one vinyl aromatic monomer unit and a polymer block (B) mainly containing at least one conjugated diene monomer unit; and a resin of a component (II) (excluding the component (I)) having a polar group, wherein a mass ration of the component (I) to the component (II) is 1/99 to 70/30.SELECTED DRAWING: None
Inventors:
MATSUOKA YUTA
SUKEGAWA TAKASHI
SUKEGAWA TAKASHI
Application Number:
JP2021172182A
Publication Date:
May 08, 2023
Filing Date:
October 21, 2021
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
C08L53/02; C08F297/04; C08L101/02
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
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