Title:
PC/ABS RESIN COMPOSITION AND RESIN MOLDED BODY OBTAINED FROM THE SAME
Document Type and Number:
Japanese Patent JP2019210376
Kind Code:
A
Abstract:
To provide a PC/ABS resin composition providing a resin molded body having excellent impact resistance while having silencing property (inhibition effect on squeak noise).SOLUTION: There is provided a PC/ABS resin composition containing a PC/ABS resin (X), a copolymer (Y), and a styrenic elastomer (Z), in which the copolymer (Y) is a graft copolymer obtained by reacting an ethylene-vinyl acetate copolymer (A), a monomer component (B) containing styrene (b-1), and one or more monomer (b-2) selected from a group consisting of (meth)acrylonitrile and epoxy group-containing monomer, and t-butyl peroxy methacryloyloxy ethyl carbonate (C), the ethylene-vinyl acetate copolymer (A) has percentage content of vinyl acetate of 1 to 20 pts.wt., a weight ratio of the ethylene-vinyl acetate copolymer (A) and the monomer component (B) ((A)/(B)) is 55/45 to 98/2, and the copolymer (Y) is 1 to 25 pts.wt. based on 100 pts.wt. of the PC/ABS resin (X).SELECTED DRAWING: None
Inventors:
ARAI HIROKI
MIMA KAZUAKI
MIMA KAZUAKI
Application Number:
JP2018107476A
Publication Date:
December 12, 2019
Filing Date:
June 05, 2018
Export Citation:
Assignee:
NOF CORP
International Classes:
C08L69/00; C08L25/08; C08L51/06; C08L53/02; C08L55/02
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office