Title:
RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
Japanese Patent JP2022065890
Kind Code:
A
Abstract:
To provide a composition which is excellent in moldability, adhesion and gas barrier property.SOLUTION: A composition contains 5-40 pts.wt. of an adhesive (a) satisfying (i) to (iii), 30-90 pts.wt. of a vinyl alcohol-based resin (b) satisfying (iv) to (v), and 5-30 pts.wt. of a polymer (h) obtained by grafting a polar polymer (g) satisfying (vi) to (vii) onto polyolefin (f). (i) hydrolyzate of a melt-kneaded substance containing polyolefin (c), an ethylene-vinyl ester copolymer (d) having a vinyl ester content larger than (c) by 5 mol% or more, and a modified body (e) obtained by grafting (c) and (d). (ii) ethylene content of 70-98 mol%. (iii) saponification degree of 5-60 mol%. (iv) ethylene content of 55 mol% or less. (v) saponification degree of 70 mol% or more. (vi) solubility factor calculated by Fedors method of 10.0 to 20.0. (vii) except for olefin-vinyl ester copolymer and its hydrolyzate.SELECTED DRAWING: None
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Inventors:
MASUDA ATSUSHI
KAWATO DAISUKE
KODA SHINGO
KAWATO DAISUKE
KODA SHINGO
Application Number:
JP2020174665A
Publication Date:
April 28, 2022
Filing Date:
October 16, 2020
Export Citation:
Assignee:
TOSOH CORP
International Classes:
C08L29/04; B32B27/30; C08L23/00; C08L77/00; C08L87/00