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Title:
RESIN COMPOSITION, MOLDED PRODUCT AND METHOD FOR MANUFACTURING MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2002332306
Kind Code:
A
Abstract:

To provide a methacrylic material having excellent heat resistance without causing cracks in the surface even in the service environment at ≥200°C.

A resin composition comprises (A) 30-60 pts.wt. monomeric mixture containing a monofunctional unsaturated monomer having methyl methacrylate as the major component and a polyfunctional unsaturated monomer having at least two radically polymerizable double bonds in the molecule, (B) 40-70 pts.wt. particles of a resin which is composed of a polymer of an unsaturated monomer having methyl methacrylate as the major component and has been partially crosslinked, (C) a radical polymerization initiator, and (D) a hindered phenolic compound having at least one tertiary butyl group in the ortho-position of the phenolic hydroxyl group.


Inventors:
AMEKAWA MUTSUHIDE
Application Number:
JP2001137085A
Publication Date:
November 22, 2002
Filing Date:
May 08, 2001
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08J5/00; C08F2/44; C08F265/06; (IPC1-7): C08F2/44; C08F265/06; C08J5/00
Domestic Patent References:
JPH06219919A1994-08-09
JPH05230143A1993-09-07
JP2000226487A2000-08-15
JP2001081268A2001-03-27
JPH05163113A1993-06-29
JPS60120735A1985-06-28
JPH10219073A1998-08-18
Attorney, Agent or Firm:
Takashi Kuboyama (2 outside)