Title:
RESIN COMPOSITION AND MOLDED PRODUCT USING THE SAME RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2003041125
Kind Code:
A
Abstract:
To provide a resin composition which improves problems caused by formation of voids such as bubbles during processing and molding, especially foaming, speckiness aggregation, voids, particle falling off, etc., during the formation of a film in the resin composition.
This resin composition comprises a resin and inorganic particles. The resin composition is characterized in that the relationship of γ powder-γ polymer≤10 mN/m holds between the surface tension (γ powder) of the inorganic particles and the surface tension (γ polymer) of the resin. A molded product is obtained from the resin.
Inventors:
IGUCHI TSUKASA
KAMIMURA TOSHIFUMI
SAWADA SEIJI
UCHIDA NOBUYUKI
KAMIMURA TOSHIFUMI
SAWADA SEIJI
UCHIDA NOBUYUKI
Application Number:
JP2001228315A
Publication Date:
February 13, 2003
Filing Date:
July 27, 2001
Export Citation:
Assignee:
TOYO INK MFG CO
International Classes:
C08J5/18; C08K3/00; C08K3/22; C08K3/34; C08L67/02; C08L67/04; C08L101/00; (IPC1-7): C08L101/00; C08J5/18; C08K3/00; C08K3/22; C08K3/34; C08L67/02; C08L67/04
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