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Title:
RESIN COMPOSITION AND MOLDED PRODUCT USING THE SAME
Document Type and Number:
Japanese Patent JP2005220335
Kind Code:
A
Abstract:

To obtain a resin composition which has little change in the outward appearance even when it is exposed to high temperatures for a long time, and besides, has good heat resistance and dimensional stability, and to provide a molded product obtained by using this resin composition.

The resin composition comprises, on the basis of 100 pts.mass of the total amount of (A) a thermoplastic polyimide resin and (B) a polyarylketone resin, 5-50 pts.mass of (C) a filler which is surface-treated with an organic silicone compound expressed by the formula (1): RnSiX4-n (wherein, R is a 1-30C hydrocarbyl group which may contain an oxygen atom; X is one or more kinds of hydrolytic groups selected from a 1-6C alkoxy group, a halogen atom, acetoxy group and hydroxy group; and (n) is 1 or 2), having an absolute value of 10 or less in the yellowness difference according to JIS K 7105-1981 between before and after the treatment at 200°C for 350 hours, and the molded product is formed of this resin composition.


Inventors:
SHIBUYA SANEHIRO
Application Number:
JP2004128089A
Publication Date:
August 18, 2005
Filing Date:
April 23, 2004
Export Citation:
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Assignee:
MITSUBISHI PLASTICS IND
International Classes:
C08L79/08; C08K9/06; C08L67/03; (IPC1-7): C08L79/08; C08K9/06; C08L67/03
Domestic Patent References:
JP2001151935A2001-06-05
JP2003313313A2003-11-06
JPS58136636A1983-08-13
JPH03199235A1991-08-30
JP2002321285A2002-11-05
Foreign References:
WO2001040380A12001-06-07
Attorney, Agent or Firm:
Tamotsu Otani
Masamichi Tohei
Kenichi Hirasawa