Title:
RESIN COMPOSITION FOR MOLDED UNDERFILL AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
Japanese Patent JP2016044211
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in both heat resistance after curing and moldability.SOLUTION: The resin composition for molded underfill contains (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) a maleimide compound. The curing accelerator (C) contains a compound represented by general formula (I-1). In the formula (I-1), Rto Rare each independently a 1-18C hydrocarbon group; at least one of Rto Ris a 1-18C aliphatic hydrocarbon group; two or more of Rto Rmay be bonded together to form a cyclic structure; Rto Rare each independently a hydrogen atom, a hydroxyl group, or a 1-18C organic group; and two or more of Rto Rmay be bonded together to form a cyclic structure.SELECTED DRAWING: None
Inventors:
NAKAMURA SHINYA
FUJIYASU YOSUKE
ITO TAKAFUMI
FUJIYASU YOSUKE
ITO TAKAFUMI
Application Number:
JP2014167977A
Publication Date:
April 04, 2016
Filing Date:
August 20, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/62; C08K3/00; C08K5/3415; C08L63/00
Domestic Patent References:
| JP2014040584A | 2014-03-06 | |||
| JP2013224400A | 2013-10-31 | |||
| JP2008111111A | 2008-05-15 | |||
| JP2016044208A | 2016-04-04 |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office
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