Title:
RESIN COMPOSITION FOR MOLDING, AND MOLDING MATERIAL MADE OF THE COMPOSITION
Document Type and Number:
Japanese Patent JPH10147722
Kind Code:
A
Abstract:
To provide a resin compsn. used as a molding material, which is excellent in wettability with an inorg. filler and surface adhesion to the filler and which does not cause troubles such as whitening even when it is boiled in an aq. alkali soln. after the molding and curing.
This compsn. comprises (A) a polymer having an acid value of not higher than 30mgKOH/g, (B) a radical-polymerizable polycarboxylic acid salt compd. which is a radical polymerizable polycarboxyl compd. having an acid value of 50mgKOH/g or higher and at least two carboxyl groups in the molecule, wherein the carboxyl groups partially or wholly form salts with a base, and (C) a radical-polymerizable monomer.
Inventors:
AWAJI TOSHIO
MIZUTANI TOMOHIRO
TOBA TAKETO
MIZUTANI TOMOHIRO
TOBA TAKETO
Application Number:
JP30851896A
Publication Date:
June 02, 1998
Filing Date:
November 19, 1996
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND
International Classes:
C08K5/09; C08F2/44; C08L101/08; (IPC1-7): C08L101/08; C08F2/44; C08K5/09
Attorney, Agent or Firm:
Etsushi Kotani (2 outside)