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Title:
RESIN COMPOSITION FOR MOLDING SHEET-FORMING, AND MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2007145891
Kind Code:
A
Abstract:

To provide a resin composition for sheet-forming that affords by a wet sheet-forming method a molding material having a low water absorption and an excellent water-resistant strength, and a molding material using the resin composition for sheet-forming.

The resin composition for molding sheet-forming comprises a novolak-type phenolic resin (A) having an ortho/para ratio of less than 2 and a solid resol-type phenolic resin (B) and has a flow distance prescribed in ISO-8619 for the resin composition for molding of 50-100 mm. The molding material comprises the resin composition for molding sheet-forming and a filler.


Inventors:
INOUE TADAYUKI
MORI KUNIO
Application Number:
JP2005338524A
Publication Date:
June 14, 2007
Filing Date:
November 24, 2005
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08L61/06; C08J5/04; C08K5/205
Domestic Patent References:
JPH10176098A1998-06-30
Attorney, Agent or Firm:
Kono Tsuyo